Publication

Byline

Location

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,241, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Sangw... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor package and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,242, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and method of manufact... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,243, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Ji Hy... और पढ़ें


US Patent Issued to Volantis Semiconductor on Aug. 25 for "Wafer-scale integration with a stiffening isometric grid array" (California Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,244, issued on Aug. 25, was assigned to Volantis Semiconductor Inc. (Portland, Ore.). "Wafer-scale integration with a stiffening isometric ... और पढ़ें


US Patent Issued to Infineon Technologies Austria on Aug. 25 for "Power semiconductor device" (Austrian, German Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,245, issued on Aug. 25, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Power semiconductor device" was invented by R... और पढ़ें


US Patent Issued to Rohm on Aug. 25 for "Semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,247, issued on Aug. 25, was assigned to Rohm Co. Ltd. (Kyoto, Japan). "Semiconductor device" was invented by Shigeru Hirata (Kyoto, Japan).... और पढ़ें


US Patent Issued to Commissariat a l'Energie Atomique et aux Energies Alternatives on Aug. 25 for "Method of assembly by direct bonding of electronic components" (French Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,248, issued on Aug. 25, was assigned to Commissariat a l'Energie Atomique et aux Energies Alternatives (Paris). "Method of assembly by dire... और पढ़ें


US Patent Issued to INNOSCIENCE (SUZHOU) TECHNOLOGY on Aug. 25 for "Nitride-based semiconductor device and method for manufacturing the same" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,792, issued on Aug. 25, was assigned to INNOSCIENCE (SUZHOU) TECHNOLOGY Co. LTD. (Suzhou City, China). "Nitride-based semiconductor device ... और पढ़ें


US Patent Issued to International Business Machines on Aug. 25 for "Single process double gate and variable threshold voltage MOSFET" (New York Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,793, issued on Aug. 25, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Single process double gate and variable thre... और पढ़ें


US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 25 for "Semiconductor devices and methods of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,794, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor devices and methods o... और पढ़ें